摘要： http://wiki.altium.com/pages/viewpage.action?pageId=3080344Land Pattern InformationDensity Level A: Maximum (Most) Land Protrusion- For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and le 阅读全文

摘要： http://en.wikipedia.org/wiki/Surface-mount_technologySurface-mount technology(SMT) is a method for producingelectroniccircuits in which the components are mounted or placed directly onto the surface ofprinted circuit boards(PCBs).An electronic device so made is called asurface-mount device(SMD).In t 阅读全文