随笔分类 - PCB
摘要：DO-214is a standard that specifies a group ofsemiconductor packagesfor surface mounteddiodes.The standard includes multiple variants such asDO-214AA (...
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摘要：The layers themselves are grouped by their functional types:Signal Layers– Top Layer, Bottom Layer, Mid-Layer 1-30Internal Planes– Internal Plane 1-16Other Layers– Drill Guide, Keep-Out Layer, Drill Drawing, Multi-LayerSilkscreen Layers– Top Overlay, Bottom OverlayMask Layers– Top Paste, Bottom Past
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摘要：http://www.centralsemi.com/product/packages/index2.phphttp://www.infineon.com/cms/cn/product/package.html?package=%2fpackages%2fSMD_-_Surface_Mounted_Deviceshttp://www.838dz.com/diode/1100.htmhttp://www.nxp.com/packages/http://www.ti.com/sc/docs/package/guide.htmhttp://www.linear.com/designtools/pac
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摘要：http://wiki.altium.com/pages/viewpage.action?pageId=3080344Land Pattern InformationDensity Level A: Maximum (Most) Land Protrusion- For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and le
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摘要：http://en.wikipedia.org/wiki/Surface-mount_technologySurface-mount technology(SMT) is a method for producingelectroniccircuits in which the components are mounted or placed directly onto the surface ofprinted circuit boards(PCBs).An electronic device so made is called asurface-mount device(SMD).In t
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