几种芯片封装
读数据手册，看到了几种不同封装的描述。记录一下。

QFP
QFP是指四方扁平式封装技术（Quad Flat Package），该技术实现的CPU芯片引脚之间距离很小，管脚很细。



QFP 有多种变种：
- BQFP: Bumpered Quad Flat Package
- BQFPH: Bumpered Quad Flat Package with heat spreader
- CQFP: Ceramic Quad Flat Package
- EQFP: Plastic Enhanced Quad Flat Package
- FQFP: Fine Pitch Quad Flat Package
- LQFP: Low Profile Quad Flat Package
- MQFP: Metric Quad Flat Package
- NQFP: Near chip-scale Quad Flat Package.
- SQFP: Small Quad Flat Package
- TQFP: Thin Quad Flat Package
- VQFP: Very small Quad Flat Package
- VTQFP: Very Thin Quad Flat Package
- TDFP: Thin Dual Flat Package.
LQFP
Low-profile Quad Flat Package 薄型四方扁平封装

TQFP
thin quad flat pack 薄QFP

VFQFPN


UFQFPN

