IPC-7711/21 - Revision D - Standard Only: Rework, Modification and Repair of Electronic Assemblies
The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures
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IPC-7711/21指南提供了印制板组件的返工、维修和修改程序，包括工具和材料、通用程序、涂层去除和图形，以帮助用户。
本指南提供了印制板组件的返工、修理和修改程序。本修订版包括之前作为变更页发布的程序、更新的一般信息和通用程序部分、使用带整体预热器的聚焦IR回流系统的BGA的新程序以及所有其他程序的一般更新
