以太网Switch和PHY芯片产商名录及产品列表
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2008年，以太网器件市场年销售额已经超过了20亿美元。然而伴随着全球性的经济衰退，2009年的销售额又萎缩至20亿美金以下。预计该市场会在2011年复苏并持续增长，至2013年增至30亿美金。 这种总体增长下，有一些大的趋势和重要的厂商。主要的趋势包括低成本FE、GE的SMB/SOHO switch，数据中心的10GbE部署，承载以太网（Carrier Ethernet）的switch。SMB/SOHO向高集成度和低功耗转换。领先的SMB/SOHO芯片供应商包括Broadcom, Marvell, Realtek,和Vitesse。 数据中心包括服务器和存储资源。虚拟化使得这些资源实现共享并增加了服务器的利用率。这要求更大的I/O带宽，导致了10GE服务器和交换机端口的增加。10GE同样是汇聚存储和数据中心的长期方案。为更好地支持数据中心应用，IEEE针对以太网增强了lossless操作和QoS。此外，刚完成的FCoE协议定义了FC存储数据通过以太网通道的传输。 然而10GE市场的缓慢发展导致了一些厂商退出。交换机市场上，Fujitsu已经停止了产品研发和新产品设计。在2009年，Marvell加入了同Broadcom和Fulcrum在10GE Switch上的战局。 除了Switch，本文还涵盖了10GE的光口、铜口和背板PHY的设计。大部分的OEM厂商都选用了SFP+光模块，用于多端口的10GE线卡。SFP+还定义了Direct Attached Cable应用，提供了数据中心中低成本的机架互联方案。OEM厂商也在寻求10GBase-LRM方案用于减少光模块价格，但是部署了该技术的产品还很少。 光口PHY的主要产商包括：NetLogic, AppliedMicro, Broadcom, ClariPhy, Cortina, Phyworks以及Vitesse。当中一些产商还更改规格至10GE的背板应用，并且已经被一些大的OEM所采用，例如HP。显然，有太多的厂商都分享着10GE的蛋糕，整合和收购是不可避免的。 因为高功耗和高成本，10GBase-T PHY的出货量一直很少。但是大部分OEM都预期其出货量会比光口多。 10GBase-T的各路厂商中，Teranetics是第一家推出功耗低于6W芯片的。2010年的竞赛围绕低于4W的10GBase-T和Energy Efficient Ethernet (EEE)特性的推出而展开。其他厂商包括：Aquantia, Broadcom, Plato Networks, Solarflare以及一些宣布会推出此类产品的厂商。 IEEE 802.3ba工作组致力于正在忙于定义比10Gbps更快的40Gbps和100Gbps以太网物理层标准。2009年底，这些标准取得了重大的突破。NetLogic发布了PHY方案，可以和Xilinx和Altera的FPGA配合使用。 承载以太网CE代表了另外一个10G以太网Switch和PHY的增长点。承载系统的以太网交换机需求关注不同于企业级的交换机。甚至对于不同的CE应用，接入系统的需求都不同于边缘系统，一些厂商增强了企业级的Switch芯片来满足CE的需求。另外，数个厂商同样致力于研发优化CE应用的Switch。包括Centec, Ethernity, Tpack, Vitesse, Xelerated以及行业领导者Marvell和Broadcom。 在数据中心，大型企业，MAN/WAN，switch fabric都需要来满足高扩展性、可用性和性能需求。 Dune Networks这家初创公司（已经被Broadcom收购）是switch fabric芯片的领导者。2009年，Broadcom推出了几款switch fabric芯片，并宣称提供一些独一无二的特性。拥有两个switch fabric的选择，更多的OEM厂商可以从ASIC中抽身到商用芯片上。 附录一 以太网Switch和PHY芯片产商名录及产品列表 AMCC 10Gbps PHY chips QT2022 QT2025 QT2225 Aquantia PHY products AQ1002 AQ1103 AQ1202 AQ1401 NetLogic PHY chips AEL1010 AEL2005 AEL2020 NLP1042 NLP2042 SFI/XFI retimer devices AEL2003 AEL2006 NLP2342 Backplane transceivers AEL3005 AEL3020 NLP3042 Plato 10GBase-T PHY PLT4001 Realtek GbE switch chips RTL8366 RTL8368 RTL8377M RTL8389M Solarflare PHYs SFT9001 SFT9002 Teranetics PHYs TN2022 TN2020 Tpack TPX devices TPX3103 TPX4004
Broadcom StrataXGS 4 switch BCM56224 BCM56226 BCM56524 BCM56624 BCM56626 BCM56820 BCM56720 SMB switch chips BCM53115 BCM53118 BCM53313 BCM53314 BCM53718 XGS core fabric BCM8823x BCM88130 10Gbps transceivers BCM8705 BCM8706 BCM8727 BCM8071 BCM8073 BCM8481 BCM84812 Centec Switch chip CTC6048 Fulcrum Switch chips FM4103 FM4104 FM4112 FM4208 FM4212 FM4224 FM4410 Marvell Prestera-DX enterprise products DX247 DX249 DX273 DX285 DX4100 Prestera-CX products CX8248 CX8234 CX8223 CX8224 SOHO switch chips E6123 E6161 E6165 Dune Petra devices P130 P220 P230 P330 Vitesse GbE switch chips G-RocX VSC7501 SparX-G5e VSC7395 SparX-G8e VSC7398 SparX-G16 VSC7389 SparX-G24 VSC7390 SparX-II VSC7401 SparX-II VSC7405 E-StaX-34 VSC7407 10GbE PHYs VSC8238 VSC8242 VSC8486 Xelerated Switch chips AX310 AX340
Ethernity ENET devices ENET3x00 ENET4x00
附录二 英文原文 The Ethernet component market in 2008 had annual revenue greater than $2 billion. With the global recession of 2009, however, we project the market will shrink to less than $2 billion. We expect the Ethernet market to recover in 2011 and continue to grow to $3 billion by 2013. In this report, we break down this growth for switches and PHYs for different data rates. We also break down the market share for each of the major vendors of switches and PHYs. Beneath this overall growth, there are significant trends and key players. The major trends include gradual conversion of low-cost SMB/SOHO switches from Fast Ethernet (FE) to Gigabit Ethernet (GbE), deployment of 10G Ethernet (10GbE) in data centers, and growth in Carrier Ethernet switches. The SMB/SOHO transition is creating products that have high integration and low power dissipation. The leading chip vendors for SMB/SOHO products are Broadcom, Marvell, Realtek, and Vitesse. We examine the strategies, current products, and future plans for each of these vendors. Data centers are consolidating both servers and storage resources. Virtualization allows these resources to be shared and increases server utilization. This increase requires greater I/O bandwidth and thus drives the need for 10GbE server and switch ports. 10G Ethernet is also the long term solution for converging the storage and data networks. To better support data-center applications, the IEEE is enhancing Ethernet for lossless operation and improved QoS. In addition, the recently finalized Fibre Channel over Ethernet (FCoE) standard defines the transmission of storage traffic over an Ethernet channel. The merchant market for 10GbE, however, has been slow to develop, resulting in several casualties. In the switch market, Fujitsu has discontinued product development and is not pursuing new designs. In 2009, Marvell joined Broadcom and Fulcrum as a 10GbE switch silicon vendor. We analyze the products from these vendors on the merits of each product for different applications. In addition to switches, this report covers 10GbE PHYs designed for optical media, copper media, and backplanes. Most OEMs are adopting SFP+ optical modules, which enable multiport 10GbE line cards. SFP+ also defines a direct-attach option that provides a low-cost solution for connecting racks in a data center. OEMs are also looking at 10GBase-LRM to reduce the cost of optical modules, but deployments of this technology continue to be small. The leading players for optical PHYs include AppliedMicro, Broadcom, ClariPhy, Cortina, NetLogic, Phyworks, and Vitesse. Several of these vendors modify their optical PHYs for 10GbE backplanes, which are already being adopted by major OEMs such as HP. Clearly, there are too many vendors chasing this market; consolidation is inevitable. Owing to high power dissipation and cost, the volume for 10GbE-overcopper (10GBase-T) PHYs has been small, but most OEMs expect these PHYs to eventually ship in greater volumes than their optical counterparts. Among the several vendors targeting 10GBase-T PHYs, Teranetics was the first to deliver a production-ready device that consumes less than 6W. For 2010, the race is on to produce a sub-4W 10GBase-T PHY and integrate Energy Efficient Ethernet (EEE) features. Other vendors in this category include Aquantia, Broadcom, Plato Networks, Solarflare, and a couple of vendors yet to announce products. Beyond 10Gbps, the IEEE 802.3ba working group is defining physical layer standards for Ethernet at 40Gbps and 100Gbps. These standards have progressed sufficiently to enable sampling of silicon products by the end of 2009. The initial products include FPGAs from Xilinx and Altera as well as PHYs from NetLogic. Carrier Ethernet (CE) represents another growth area for vendors of Ethernet switches and PHYs. The requirements of Ethernet switches for carrier systems differ from those of enterprise switches. Even among CE applications, products for access systems have different requirements than those for edge systems. Some vendors are enhancing their existing enterprise-focused switch chips to meet CE requirements. Additionally, several vendors are either sampling or developing switch chips optimized for CE applications. These vendors include Centec, Ethernity, Tpack, Vitesse, and Xelerated in addition to market leaders Marvell and Broadcom. Within the data center, large enterprise, and metro/wide-area networks, switch fabrics are needed to meet high-end scalability, availability, and performance requirements. Dune Networks is the leading supplier of switch-fabric chips, outlasting the early group of startups. In 2009, Broadcom significantly updated its switch-fabric chips, which now offer several unique features. With two choices of excellent switch fabrics, more OEMs may be enticed to move from ASICs to merchant silicon. To help with this transition, we offer an independent comparison of these fabrics. For each of these markets—SMB/SOHO, enterprise, data center, and Carrier Ethernet—this report provides technical background, typical systems, and market trends. The report analyzes the vendors and their products for these markets. Finally, we compare products in each category and provide guidance on the best product for different applications. |
